Abstract
Techniques generally used to measure stress in thin films cannot give sufficient information to be correlate to film properties. An in situ stress measurement method is described in this paper. This optical technique, based on the cantilever one, allows to follow up the evolution of intrinsic stress with film thickness. It provides complementary information which can be correlate with film microstructure. Moreover, after deposition, this technique determines the Young's modulus and thermal expansion coefficient of the film by measuring the thermal stress during cooling.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
