Abstract
The role of each chemical component in Cu electroless deposition (ELD) solution was investigated in real-time by open-circuit potential (OCP) measurement assisted by quartz crystal microbalance. It was observed that Cu was continuously oxidized in alkaline bath. However, when ethylenediaminetetraacetic acid (EDTA), a well-known complexing agent, was in the solution together, EDTA was found to participate in the removal of Cu oxide formed on the surface as well as the complexation of Cu ions in the solution. Formaldehyde, a reducing agent, was adsorbed onto the Cu surface and inhibited further Cu oxidation in the alkaline media. Both components maintained low oxygen content on the Cu surface in the alkaline solution. Coulometric reduction method and X-ray photoelectron spectroscopy analysis revealed that the surface had a small amount of Cu2O. During Cu ELD process, the induction period was observed at the initial stage of the deposition and it was related with the time that methylene glycol anions were adsorbed and became activated on the surface. The OCP measurement during Cu ELD also indicated that the deposition followed the mixed potential theory to some extent.
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