Abstract
Real-time observations of the film stress–thickness product are presented from the growth of strained InGaAs/GaAs layers. Growth temperatures of 440 and 520 °C were used with a nominal In composition of x=0.20. The data are compared with a model of relaxation kinetics based on dislocation glide velocity. The residual strain is higher than predicted and the relaxation is not markedly temperature dependent, in contrast to the model. These discrepancies suggest that dislocation blocking causes incomplete relaxation in this material system.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
