Abstract
During solder reflow of smaller and smaller microelectronic interconnections, a robust soldering process can become challenging, resulting in opens or bridging. In this work, a customized real time resistance monitoring (RTRM) setup is developed to observe the resistance of a solder connection in real-time during reflow to better understand the challenges of soldering. Two types of solder paste are studied with RTRM. Solder A was fresh while solder B was one year old. We found solder B in general has a lower room temperature resistance before reflow than solder A. During reflow, the resistance signals behave differently between solder A and solder B. For example, in solder B, an episode of high resistance (24.40 ± 16.04 kΩ) is observed for 4–58 s not long before melting, while solder A mainly shows resistance drops in the early stage of reflow. Microscopic images and cross-sectioning studies with respect to the special events in the resistance signal show solder compacting, solder sintering, flux segregation, and final open or connection. RTRM can be a helpful tool when developing smaller solder processes for thin film substrate with miniaturized passive and active components.
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