Abstract
ABSTRACTRecent advances in instrumentation and data analysis have made spectroscopic ellipsometry a routine analytic tool with submonolayer sensitivity for monitoring and controlling cleaning, etching, deposition, or other processes that take place in relatively high-pressure or reactive environments. We discuss representative applications in chemical etching, plasma processing, and MOCVD to illustrate analytical procedures and to indicate other potential uses of the technique. The possibility of extracting surface information already carried in the polarization state of the processing laser beam is also discussed.
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