Abstract
Reactive wetting processes of molten Sn-3.5Ag on Cu substrates at elevated temperatures were investigated by the sessile drop method. Equilibrium contact angles of Sn-3.5Ag on Cu substrates are 36.5°, 32.9°, 25.25°, and 32.1° at 523 K, 573 K, 623 K, and 673 K, respectively, indicating that the contact angle does not decrease monotonically with increasing temperature. It is also found that the maximal triple-line mobility does not increase linearly with temperature. The complicated temperature effects on the equilibrium contact angles and triple-line mobility are attributable to the fact that Cu substrates dissolve easily in the liquid solder, hindering solder spreading. A description of the equilibrium state helped explain the triple-line region of the Sn-3.5Ag/Cu joint. The calculated results, based on the experimental values of tension balances along each of the three interfaces, show good agreement with the theoretical analysis. The present results are of practical interest for composite lead-free solder preparations and joining of Sn-3.5Ag to Cu substrates.
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