Reactive magnetron sputtering of uniform yttria-stabilized zirconia coatings in an industrial setup

Abstract

Yttria-stabilized zirconia (YSZ) thin films were deposited by reactive magnetron sputtering in an industrial scale setup on silicon wafers as well as commercial NiO-YSZ fuel cell anodes. The texture, morphology, and composition of the deposited films were investigated as a function of deposition parameters. Homogeneous coatings could be deposited over large areas within the coating zone, which is important for industrial applications. The use of substrate bias during film growth was identified as a key parameter to promote less columnar coatings and made it possible to tailor the texture of films deposited on Si. Bias voltages≤−40V resulted in highly <200> textured YSZ films, intermediate bias voltages of −50V to −70V in <220> textured films and high bias voltages (≥−90V) in a mixed orientation. In contrast, films grown on NiO-YSZ were seen to be randomly orientated when deposited at substrate bias voltages≤−30V. When bias was further increased the film took over the orientation of underlying substrate due to substrate template effects.