Reaction mechanisms between chlorine plasma and a spin-on-type polymer mask for high-temperature plasma etching

Abstract

To satisfy the requirement for mask materials in high-temperature plasma etching, a novolac-based polymer mask was evaluated during high-temperature Cl2 plasma etching. Although the etch rate of 8 nm/min was rather high at a low temperature of 230 °C, it decreased with the increase in temperature. The aromatic ring structures were significantly modified by vacuum ultraviolet (VUV) and Cl radicals during the processes above 300 °C and transformed to a highly cross-linked amorphous carbon (a-C) layer at the surface confirmed from infrared and Raman spectra. The formation of this a-C layer improved the etching resistance of the polymer mask. On the other hand, surface roughness can also be improved after processes above 300 °C corresponding to the generation of the a-C layer. Therefore, this polymer mask is a promising candidate for high-temperature plasma etching with high etch resistance, and a smooth surface can be obtained during processes above 300 °C.