Abstract
The technique of molecular statics (MS) simulation was employed to determine the crack growth resistance curve of Cu and Ni single crystals. Copper and Ni single crystal nanoplates with an edge crack subjected to a tensile displacement were simulated. Stress-displacement curves and snapshots of the atomic configuration corresponding to different displacement levels were presented to elucidate the deformation mechanism. It was observed that the edge crack propagated step by step in a brittle manner, and the amount of crack growth at each step was half the lattice parameter. Through an energy consideration, the critical strain energy release rate at the onset of crack propagation and the crack growth resistance were calculated. The crack growth resistance is larger than the critical strain energy release rate because of the crack growth effect.
Highlights
Nanostructured materials have attracted considerable attention from both research communities and technology companies, due to their amazing optical, thermal, mechanical, electrical, and magnetic properties [1,2,3,4,5]
This study focused on the measurement of R-curve of nanomaterials based on atomistic
Molecular statics simulations of the tensile deformation of Cu and Ni single crystal nanoplates statics simulations deformation of Cu and Ni dynamics single crystal nanoplates with Molecular an edge crack were conductedof atthe
Summary
Nanostructured materials have attracted considerable attention from both research communities and technology companies, due to their amazing optical, thermal, mechanical, electrical, and magnetic properties [1,2,3,4,5]. The past several decades have witnessed their wide application in nanoelectromechanical systems such as sensors, actuators, resonator, piezoelectric nanogenerators, and oscillators. Cracks may be introduced into these devices during the fabrication process. External mechanical or thermal loading may lead to the nucleation of cracks. A crack may arrest or propagate in a solid, depending on the loading condition as well as on the crack growth resistance (R), which characterizes the material’s resistance to crack growth.
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