Abstract
Heat management in electronics and photonics devices is a critical challenge impeding accelerated breakthrough in these fields. Among approaches for heat dissipation, thin-film evaporation with micro/nanostructures has been one of the most promising approaches that can address future technological demand. The geometry and dimension of these micro/nanostructures directly govern the interfacial heat flux. Here, through theoretical and experimental analysis, we find that there is an optimal dimension of micro/nanostructures that maximizes the interfacial heat flux by thin-film evaporation. This optimal criterion is a consequence of two opposing phenomena: nonuniform evaporation flux across a liquid meniscus (divergent mass flux near the three-phase contact line) and the total liquid area exposed for evaporation. In vertical micro/nanostructures, the optimal width-to-spacing ratio is 1.27 for square pillars and 1.5 for wires (e.g., nanowires). This general criterion is independent of the solid material and th...
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