Rate of dissolution of solid nickel in liquid tin under static conditions

Abstract

The dissolution kinetics of solid nickel in liquid tin have been investigated under static conditions. The cylindrical nickel specimens were immersed in liquid tin over the temperature range of 551 to 803 K in the reaction time range of 0.9 to 6.0 ks. A natural convection model for mass transfer and the dissolution rate equation derived by considering intermetallic compound layer formation were used to interpret the experimental dissolution data. A larger dissolution at the upper part of specimen causing natural convection and an intermetallic layer formation with a linear relationship at solid/liquid interface occurred. Below 628 K, the dissolution rate appears to be controlled by chemical reaction of an intermetallic compound layer. At mid-range temperatures (of 681 K), the dissolution process was governed by a mixed control mechanism involving diffusion in liquid tin and chemical reaction of the intermetallic compound layer. At temperatures above 735 K, the rate seems to be controlled by diffusion across a concentration boundary layer in liquid tin. The formation of an intermetallic compound layer did not interfere with the dissolution.