Abstract
A rate dependent constitutive model, the Anand model, was applied to represent the inelastic deformation behavior for a Pb-rich solder 92.5Pb5Sn2.5Ag used in electronic packaging and surface mount technology. This rate dependent model is a unified viscoplastic constitutive model using an internal state variable, the deformation resistance, to describe the averaged isotropic resistance to macroscopic plastic flow. In order to obtain the acquired data for the fitting of the material parameters of this unified model for 92.5Pb5Sn2.5Ag solder, a series of experiments of constant strain rate test and constant load creep test were conducted under isothermal conditions at different temperatures ranged from -65/spl deg/C to 250/spl deg/C. A procedure for the determination of material parameters was proposed in this paper. Model simulations and verifications revealed that there are good agreements between model predictions and experimental data. Moreover, some discussions on using this rate dependent model in the finite element simulation of stress/strain responses of solder joints under thermal fatigue loading were presented.
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