Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Abstract

Ratcheting behavior of sandwiched structure joined by sintered nanosilver was studied by both experiment and simulation. An electronic universal testing apparatus and an innovative non-contact detecting system were developed to measure deformation of the sintered nanosilver joints. The effect of force amplitudes, mean forces, and peak forces at room temperature on the ratcheting behavior of the sintered nanosilver joint was investigated by force-controlled cyclic shear tests. A viscoplastic constitutive model based on Ohno–Wang and Armstrong–Fedrick (OW–AF) nonlinear kinematic hardening rule and Anand model were embedded in ABAQUS to predict the ratcheting behavior of the sintered nanosilver joint. The higher the force amplitude, mean force, and peak force, the larger the ratcheting displacement of the sintered nanosilver joint. Predicted results of OW–AF model agree with experiment better than those of Anand model.