Abstract
ABSTRACTNondestructive characterization techniques for substrates, epilayers, and device structures are becoming increasingly important in the semiconductor industry. Synchrotron-based white-beam x-ray topography, x-ray rocking curve measurements, and etch pit density were used to map the defect structure in a variety of CdTe and CdZnTe single crystal substrates, which are important for IR detector applications involving HgCdTe. Defects such as low angle grain boundaries have been successfully correlated using topography, rocking curves, and etch pit density, and twins have been observed using topography and rocking curves. The effectiveness of white-beam synchrotron topography for rapid and nondestructive defect analysis and substrate screening is discussed.
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