Abstract
We achieved robust bonding of a large area power chip (>100 mm2) with sintered Ag joint produced by the electrical current assisted sintering (ECAS) technique operating at low current (1.1 kA) and short sintering time (10 s). Our ECAS-ed Ag joint possessed low thermal resistance (∼0.18 °C/W), high density (89.6%), as well as good static and dynamic electrical properties during switching on and off of the power chip. Our TEM analysis explained that the good electrical and thermal performances of the power chip were attributed to the high density of twins formed in the ECAS-ed nano-Ag joint.
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