Abstract
The excellent properties of diamond make it a highly promising substrate material for future sensors and semiconductor devices. The surface roughness of the substrate material directly impacts the performance of the devices. Therefore, achieving efficient and low-damage processing of diamonds is crucial. However, diamond has high hardness and chemical inertness, which makes it difficult to process. To tackle the above-mentioned problem, the diamond film was ground using a grinding wheel containing nickel (Ni)-plated diamond abrasives based on the mechanochemical effect. The maximum average material removal rate of the diamond film reached 2469 nm/min under a grinding pressure of 600 N at a speed of 600 rpm, and the minimum average surface roughness of the diamond film reached 3.93 nm under 500 N 600 rpm. The rapid reaction removal of the diamond film can be attributed to the catalytic effect of the Ni plating, inducing graphitization of the diamond film at the interface contact points under the generated high temperature during friction; subsequently, it can be removed under the mechanical action of the abrasives. This work has tremendous potential for the efficient and low-damage grinding of diamond films.
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