Abstract
The kinetically spraying method was used to fabricate an in situ copper- (Cu-) tin (Sn) intermetallic compound (IMC) film with its thickness of approximately 1 μm using a Cu-Sn mixed powder. Microsized Cu (~5 μm) and Sn (~10 μm) powders were mixed at its ratio of 45 : 55 wt.%, respectively, and then deposited onto a silicon substrate, forming an IMC layer. The actual composition of the deposited film was measured to be at a Cu : Sn ratio of 36 : 64 wt.% (in situ kinetically sprayed at 200°C). This kinetically sprayed process uses the energy source of collision and heat energy simultaneously, leading to the formation of an IMC phase. The IMC phase of Cu6Sn5 was formed successfully within 3 minutes of in situ deposition. Moreover, we obtained a Cu6Sn5 phase when the thin film was annealed in a furnace for 1 hour immediately after kinetically spraying at room temperature. However, an IMC phase was not formed in the thin film when kinetically sprayed at room temperature followed by heating on a hot plate for 3 minutes. It seems that the simultaneous supply of collision and heat energy is crucial to result in phase formation. Therefore, we have proven that the kinetically spraying process is capable of fabricating a super-thin layer of IMC film within a short time.
Highlights
Copper- (Cu-) tin (Sn) intermetallic compounds have numerous advantages that have led to their being widely used in various applications, such as in semiconductors, vessels, and vehicles
It seems that in situ deposition at 200°C for 3 min resulted in the comparable formation of the Cu-situ copper- (Cu-) tin (Sn) intermetallic compound which can be obtained after heat treatment in the furnace for 1 hour
Cu and Sn particles deposited at room temperature were uniformly distributed over the Si substrate, whereas the in situ deposited thin film at 200°C for 3 min showed plastically deformed Sn, which could be used as a matrix for Cu deposition
Summary
Copper- (Cu-) tin (Sn) intermetallic compounds have numerous advantages that have led to their being widely used in various applications, such as in semiconductors, vessels, and vehicles. The corrosion resistance of Cu-Sn intermetallic compounds can be controlled and enhanced by increasing the ratio of Sn in the intermetallic compound [1, 2] Due to these advantages, Cu-Sn intermetallic compound films are often fabricated using solution-based processes, such as electrodeposition and sol-gel [1, 5, 6]. A uniform intermetallic compound phase can be obtained through powder processing, followed by posttreatment at high temperatures, while a long time is required to obtain an intermetallic compound phase. As a result, these fabrication processes raise some disadvantages, such as using a toxic solvent and consumption of heat energy. We have demonstrated the possibility of fabricating an intermetallic compound thin film within a short amount of time, showing its application on solder thin films as well as on color-changing thin films
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