Abstract
A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders. The results showed that with the current intensities increasing from 0.8KA to 1.2KA, the thickness of IMCs, Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> Sn <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> , increased from less than 1μm to 4.2μm for 0.2s, which was induced by thermoelectric coupling interfacial interaction at the liquid solder/solid metallization interface. In addition, amount of dendritic Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> Sn <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> distributed in the Sn matrix at the bottom right corner of solder joint under the current intensity of 1.2KA, which was caused by the current crowding effects. Lastly, the share strengths of Cu/Sn/Cu solder joints under the rapid bonding process were improved with the bonding current increasing. The share strength was up to 51.9MPa at 1.2KA.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
