Abstract
Surface mount technology is an important process in modern electronic circuit manufacturing. Quality control problems have arisen in this area because of the increased design and processing complex...
Highlights
Surface mount technology (SMT) refers to the set of electronic circuit manufacturing processes by which the electronic components are mounted on the surfaces of printed circuit boards (PCBs).[1]
With the increase in electronic circuit density and decrease in the size of the electronic devices, SMT is becoming an essential stage in the electronic packaging process.[2]
We proposed a data-driven method to identify fault causes in SMT processes, which have become increasingly complex and more vulnerable to inaccurate and time-consuming human inspection
Summary
Surface mount technology (SMT) refers to the set of electronic circuit manufacturing processes by which the electronic components are mounted on the surfaces of printed circuit boards (PCBs).[1]. Yang et al.[21] proposed a neural network–based method to predict quality in the stencil-printing processes often applied to SMT, employing eight control variables, including stencil thickness, stroke speed, and squeegee pressure, to predict the printed paste volume. Most of these previous research efforts focused on detecting faults to improve the performance of a single automated inspection step, such as AOI, by using datadriven methods based on digital images or control variables. The proposed method does not require any training stages, enabling a rapid analysis, as demonstrated by a case study conducted using real-world SMT data collected from the processing and inspection steps. The case study is conducted with a real-world factory-wide SMT dataset
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