Rapid Carbon Dioxide Foaming of 3D Printed Thermoplastic Polyurethane Elastomers

Abstract

Polymeric foam preparation using the carbon dioxide (CO2) foaming technique is fascinating. Until now, the CO2-based foaming process has been carried out for a long saturation time. Once it is possible to produce a polymeric foam in a low saturation time, it can enhance foam production. This study investigates the foaming behavior of 3D printed TPU samples with three different hardness values. The variation of infill density in 3D printed samples provides a macroporous range in the sample and creates a path for the gas molecules to reach the polymer. Such a gas flow path expands the foam processing technique to be carried out at low saturation time and pressure. The foaming process carried out here follows two steps: first, CO2 gas saturation in a high-pressure stainless-steel vessel; second, then hierarchical microporous generation by devising a thermodynamically unstable condition by placing the gas saturated sample in a hot water bath set up. The results showed that the increase in saturation time and pressure increases the expansion behavior of the foam samples, whereas an increase in infill density restricts the foam expansion behavior. The crystalline hard segment (HS) enhances the heterogeneous cell nucleation and reduces the shrinkage of the foam samples. The foam sample with low infill density showed low compression strength. It could be improved by filling the macroporous gap with hydrogel during printing. This hydrogel-packed low infill density foam showed an increased compression strength of 0.8 MPa at 80% strain than the neat foam sample (without hydrogel) 0.12 MPa at 80% strain, confirmed through the cyclic compression test. Hence, this 3D printing integrated subcritical solid-state foaming system offers unparalleled freedom to design and create foam and increase its production. The one-pot preparation of low-density higher compression strength foam using hydrogel makes this technique more feasible for high-end applications.