Rapid and Localized Soldering Using Reactive Films for Electronic Applications

Abstract

Abstract The rapid and localized heating techniques allow the joining of temperature-sensitive materials and components without thermal induced damage commonly encountered when high-temperature solder reflow processes are used. This is also advantageous for making assemblies with materials having a large difference in the coefficient of thermal expansion without induced bowing or cracking. The use of exothermic reactive foil sandwiched between solder preforms is a promising local and rapid soldering process because it does not require any external heat source. The reactive foil is formed from alternatively stacked nanolayers of Ni and Al until it reaches the total film thickness. Once the film is activated by using an external power source, a reaction takes place and releases such an amount of energy that is transferred to the solder preforms. If this amount of energy is high enough, solder preforms melt and insure the adhesion between the materials of the assembly. The influences of the applied pressure, the reactive film (RF) thickness as well as the solder, and the attached materials chemical composition and thickness were investigated. It was shown that the applied pressure during the process has a strong effect on the joint initial quality with voids ratio decreases from 64% to 26% for pressure values between .5 and 100 kPa, respectively. This can be explained by the improvement of the solder flow under higher pressure leading to a better surface wettability and voids elimination. Otherwise, the joint quality was found to be improved once the solder melting duration is increased. This relationship was observed when the thickness of the reactive foil is increased (additional induced energy) or the thickness of solders, Cu, and/or Si is decreased (less energy consumption). The microstructure of the AuSn joint achieved using the RFs shows very fine phase distribution compared with the one obtained using conventional solder reflow process in the oven because of high cooling rate. The mechanical properties of the joint were evaluated using shear tests performed on 350-μm-thick silicon diodes assembled on active metal brazed substrates under a pressure of 100 kPa. The RFs were 60 μm thick and sandwiched between two 25-μm-thick 96.5Sn3Ag.5Cu (SAC) preforms. The voids ratio was about 37% for the tested samples and shear strength values above 9.5 MPa were achieved which remains largely higher than MIL-STD-883H requirements. Finally, the process impact on the electrical properties of the assembled diodes was compared with a commonly used solder reflow assembly and the results show a negligible variation.