Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Abstract

To accomplish densification, pure copper (Cu) sintering, which is a solid phase sintering, necessitates extremely high pressure and temperature. The inclusion of an activator can speed up the diffusion of copper atoms, allowing the densification process to proceed more quickly. The carbonized polymer dot (CPD) via ball milling and spark plasma sintering to obtain a composite with full densification at low temperatures. Effects of sintering temperature on interface of CPD–Cu and the impact of CPD as an activator on pure Cu sintering densification are investigated in this study. Following are the results: Cu matrix composites can be densified at low temperatures by adding CPD, CPD/Cu composites have a relative density of 99.4%, and a hardness up to 130.94 HV while sintering temperature is just 550 °C.