Abstract
Adsorption of chloride ions and thiourea on electrodeposited porous copper layers has been studied in acidic medium (1 mol dm −3 HClO 4) by a radiotracer method using 36Cl labelled HCl and 14C labelled thiourea. It has been stated that the character of the potential dependence of the adsorption of chloride ions on a “copperized” electrode is very similar to that found in the case of a platinized platinum ellectrode; therefore a similar explanation of the phenomena observed may be given in both cases. It has been shown that the onset of the dissolution processes of copper is preceded by a significant adsorption of chloride ions. Potential dependence of thiourea was studied in a wide potential range (−400 to 300 mV on rhe scale) where a strong adsorption was found. Inhibition of cathodic and anodic processes by thiourea was studied by simultaneous radiotracer and polarization measurements, and a correlation between coverage with respect to thiourea and that will respect to the reaction rate was found.
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