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Abstract
The coercivity of rf‐sputtered thick NiFe films (≳0.3 μm) on thick gold (≳0.3 μm) is generally lower than in films deposited by thermal evaportion. Especially low values of coercivity (Hc?0.7 Oe) are obtained in NiFe films on gold conductors which are deposited onto thin adhesive layers of refractory metals having lattice parameters around 3 A. For a given NiFe film thickness, the coercivity is found to decrease with increasing gold thickness up to 1 μm in sharp contrast to evaporated films.
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