Abstract
Printed circuit boards (PCBs) are the primary source of EMI. The manner of propagation of an undesired RF field depends on the type of antenna configuration present within the structure. Unwanted EMI is also created within cable interconnects, lead-bond wires, poor power distribution networks, simultaneously switching noise, crosstalk, and from the physical edge of the PCB assembly between a power and return plane pair. This paper examines the magnitude of the RF field that may cause harmful EMI to adjacent assemblies only from the edge of the board. Designers are faced with numerous obstacles when creating a PCB due to increasing demand for higher operating frequencies and greater functionality. Engineers generally do not concern themselves with board edge radiated emissions, thus this study.
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