Radiance RTP wafer out of pocket alarm influenced by preheat recipe

Abstract

This paper characterizes the alarm of the Applied Materials 200 mm Radiancetrade Centura for thinner wafer process. The Radiance spike anneal process is distinguished by fast ramp-up and cool-down rates, radically symmetric honeycomb heat source with 211 lamps, high throughput by fast lift pins and Maglev wafer rotation for higher speed. The speed of the rotation assists uniform heat distribution and process results. However, to reduce the weight carries by Maglev controller, a thin edge ring is designed. An alarm dasiawafer out of pocketpsila occurred frequently due to thin edge ring and rotating process. In this paper, numerical techniques are given for the findings of preheat recipe lamp power settings to minimize wafer out of pocket alarm. These numerical techniques involved the temperature profile and chamber components.