Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

Abstract

In this study, a new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn−Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part II to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.