Abstract
Two types of hardening were observed on ageing after quenching Cu wire, depending on the quenching temperature. A comparison of the observed quench hardening in Cu and Au with the decay of quenched-in resistivity in Au shows that the two types of hardening can be explained assuming two types of sinks for vacancies as discussed in Part I. For high quenching temperatures, the hardening is considered to be due to the formation of sessile rings; for low quenching temperatures, to the annihilation of vacancies at pre-existing dislocations. Detailed mechanisms for the annihilation of vacancies are discussed. The activation energies for migration of single- and di-vacancies in Cu are found to be about 0.7 eV and about 0.6 eV, respectively.
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