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Abstract
A new 3D process is proposed for inertial MEMS sensors where a thin transduction layer based on high-density surface-varying comb fingers, with nano-metric gaps, is patterned below a thick seismic mass layer. The objective is to achieve high-performance in a reduced footprint. An in-plane accelerometer is designed, fabricated with this new 3D process, and tested under acceleration. Initial fabricated devices demonstrate a full-scale range of ±160 g, $7~\mu {g}/ \sqrt {\textit {Hz}}$ Brownian noise floor and more than 4 kHz bandwidth. These figures translate into a dynamic range of more than 150 dB (normalized to 1-Hz bandwidth) with an overall footprint of only ${400}\times {600}\,\,\mu {m}^{{2}}$ .
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