Abstract

We demonstrate experimental results based on time-resolved photoluminescence spectroscopy to determine the oscillator strength and the internal quantum efficiency (IQE) of InGaAs quantum dots (QDs). Using a strain-reducing layer, these QDs can be employed for the manufacturing of single-photon sources emitting in the telecom O-Band. The oscillator strength and IQE are evaluated by determining the radiative and non-radiative decay rates under the variation of the optical density of states at the position of the QD for InGaAs QDs emitting at wavelengths below 1 μm. For this purpose, we perform measurements on a QD sample for different thicknesses of the capping layer realized by a controlled wet-chemical etching process. From numeric modeling of the radiative and non-radiative decay rates dependence on the capping layer thickness, we determine an oscillator strength of 24.6 ± 3.2 and a high IQE of (85 ± 10)% for the long-wavelength InGaAs QDs.

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