Abstract
The glass transition temperatures of nine stoichiometric resin systems of tetraglycidyl-4,4′-diamino-diphenylmethane (TGDDM), triglycidyl p -amino phenol and diglycidyl ether of bisphenol A with 4,4′-diaminodiphenylsulphone (DDS), diethyl-toluenediamine and dimethylthiotoluenediamine were calculated using group interaction modelling (GIM) and atomic additivity (AA) methods. The input parameters were generated from kinetics simulation, which outputs the structure information for the cured systems. The modelling parameters were also applied to four non-stoichiometric systems of TGDDM and DDS. The predicted values from GIM were in good quantitative agreement with measured results from temperature modulated differential scanning calorimetry for all systems studied. Compared to GIM, the AA method gave inferior predictions for the highly crosslinked systems, especially for those, where epoxy was in excess.
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