Abstract
Results of quantitative spectroscopic analysis of packaging-induced strain in In 0.06 Ga 0.86 Al 0.08 As/Ga 0.7 Al 0.3 As/GaAs high-power cm-bars diode laser arrays are presented. Theoretically, the influence on the results of particular device structure properties, such as intrinsic Strain, is analyzed. We compare these theoretical results, which are based on a unaxial stress model. with photocurrent data. For In-soldered devices on copper heatsinks, we find a strain difference of (0.050 ± 0.015)% between edge and center of the device. Almost complete strain-relaxation toward the device edges is experimentally demonstrated. The general approach is also applicable to the analysis of all data that refer to changes of the electronic bandstructure, such as absorption and photoluminescence.
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