Quantitative modelling of nucleation kinetics in experiments for poly-Si growth on SiO 2 by hot wire chemical vapor deposition

Abstract

We apply a rate-equation pair binding model of nucleation kinetics to the nucleation of Si islands grown by hot wire chemical vapor deposition on SiO 2 substrates. The grain size of poly-Si films increases with H 2 dilution, which is attributed to atomic H etching of Si monomers rather than stable Si clusters during the early stages of nucleation. The nucleation density increases sublinearly with time at low coverage, implying a fast nucleation rate until a critical density is reached, after which grain growth begins. The nucleation density decreases with increasing H 2 dilution (H 2:SiH 4) due to etching, and with increasing temperature, due to enhanced Si monomer diffusivity on SiO 2. From temperature-dependent measurements, we estimate the activation energy for surface diffusion of Si monomers on SiO 2 to be 0.47±0.09 eV. Simulations of the temperature-dependent supercritical cluster density lead to an estimated activation energy of 0.42±0.01 eV and an estimated surface diffusion coefficient prefactor of 0.1±0.03 cm 2/s.