Abstract
By refining the etching technique and subsequent graphic processing, the contiguity, relative alignment and thickness of grains in Ag-sheathed Bi(2223) tape were evaluated from a cross-sectional electron micrograph. Graphic processing was achieved by digitization, inversion and skeletonization of each grain, followed by a description of the two-dimensional distribution of the three-forked crossings (`switches') and the grain thickness. A simple quasi-linear relation between the switch density and the critical current density, J C, was observed, indicating the significance of the grain contiguity.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
