Abstract
The nanoimprint lithography process consists of two mechanical steps: molding and stampremoval. While many publications dealing with anti-sticking layer properties or theunderstanding of polymer flow during imprinting have recently been published, only a fewstudies have been carried out to deeply characterize the demolding step. Regarding thesmall amount of theoretical work dedicated to this issue, in this paper both experimentaland first theoretical approaches are proposed to characterize the demolding process in apeeling scheme. Full 200 mm stamp and imprinted wafers were used to identify theexperimental limitation of such a full wafer peeling demolding scheme. A rectangularstamp and substrate samples with or without nanoscale features combined with anaugmented beam theory are proposed to extract quantitative data for the requireddemolding force as well as the friction stress along the feature sidewall. Thereforeboth adhesion and friction forces were characterized on single stamp structures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
