Abstract
Finite element analysis has been applied for a quantitative understanding of the crack closure stress-separation function due to the grain-bridging mechanism in polycrystalline ceramics. The grain-bridging process of a two-dimensional planar array model was analysed and the crack closure stress during crack bridging under a single-bridging condition was obtained as a function of the crack separation. The effects of grain size, Young's modulus and coefficient of friction for interfacial sliding on the crack closure stress were obtained numerically. The results showed that the grain-bridging process was made up of three characteristic stages. The major contribution to grain bridge toughening is interlocking of grains that operate at the first stage. The crack closure stress at the same crack separation tended to increase with increasing Young's modulus and decreasing grin size respectively.
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