Abstract
Nano-surface modification techniques have been increasingly reported in a multitude of applications. However, the metal-ligand interface can be difficult to characterize, mainly due to the inadequacy of analytical methodologies. Here, we analyze this interface using transmission electron microscopy, which can determine the thickness of the linkers. This work presents a comprehensive physical characterization of gold nanoparticles with modified surfaces using conventional transmission electron microscopy. We have successfully demonstrated a simple and reliable protocol for the quantification of inter-particle spacing caused by SAM thiol ligands bound onto AuNPs. This approach is based on the linear correlation of the distance between the gold nanoparticles and the length of 3-mercaptopropionic acid (MPA), 11-mercaptoundecanoic acid (MUA), and 16-mercaptohexadecanoic acid (MHA).
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