Abstract

Pulsed-radio frequency glow discharge optical emission spectrometry (Pulsed-RF-GDOES) has exhibited great potential for high resolution (HR) depth profiling. In this paper, the measured GDOES depth profile of 60 × Mo (3 nm)/B4C (0.3 nm)/Si (3.7 nm) was quantified by employing the newly extended Mixing-Roughness-Information depth (MRI) model. We evaluated the influences of the thickness and sputtering rate on the depth profile of very thin layers. We demonstrated that a method using the full width at half maximum (FWHM) value of the measured time-concentration profile for determining the sputtering rate and the corresponding thickness was not reliable if preferential sputtering took place upon depth profiling.

Highlights

  • Glow discharge optical emission spectrometry (GDOES) was initially developed for measuring the composition distribution of conductive thick films [1]

  • It is a great challenge for such ultrathin layers to come back to the original in-depth concentration profiles since all the distortion effects resulting from the GDOES depth profiling must be taken into account, i.e., preferential sputtering, atomic mixing from sputtering, surface/interface roughness resulting from sputtering, and/or sample nature or preparation, and the information depth from the analyzer

  • The extended MRI model developed for multi-element thin films was successfully applied to quantify the measured GDOES depth profiling data of 60 × Mo (3 nm)/B4 C

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Summary

Introduction

Glow discharge optical emission spectrometry (GDOES) was initially developed for measuring the composition distribution of conductive thick films [1]. The quantification of a monolayer depth profile has even shown that the depth resolution of Pulsed-RF-GDOES could sometimes reach the sub-nanometer range thanks to flexibility in adjusting the pulsed radio frequency parameters [9]. It is a great challenge for such ultrathin layers to come back to the original in-depth concentration profiles since all the distortion effects resulting from the GDOES depth profiling must be taken into account, i.e., preferential sputtering, atomic mixing from sputtering, surface/interface roughness resulting from sputtering, and/or sample nature or preparation, and the information depth from the analyzer. The sputtering rate of each element and the individual layer thicknesses in the Mo/B4 C/Si multilayer are obtained

Extended MRI Model
Simulation and Discussion
Findings
Note linear relation indicates there is matrix no matrix effect upon
Conclusions
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