Abstract

AbstractThe investigation was intended to examine the influence of selected moisture levels (4.26, 12.66, 25.31, 37.89, 50.21% wet basis) on engineering properties namely, dimensional, gravimetric, frictional, aerodynamic as well as mechanical properties of five selected varieties of sesame seed namely GT‐3, GT‐4, GJT‐5, GT‐6, and TKG 22. The investigation finds out that fluctuations in moisture level significantly (p ≤ 0.05) influenced the engineering properties assessed. Increase in moisture content influenced a rise in length, width, thickness, geometric mean diameter, arithmetic mean diameter, sphericity, volume, volumetric expansion coefficient, elongation ratio, flakiness ratio, surface area, projected area, thousand seeds weight, compressibility index, Hausner ratio, angle of repose, coefficient of friction, terminal velocity and Reynolds number of selected sesame verities. Whereas, a reverse trend was observed in aspect ratio, true density, bulk density, tapped densities, drag coefficient, and hardness with moisture content variation. The frictional characteristic of the seed showed improved stability with less flow ability at higher moisture levels. These outcomes disclosed that variation of seed moisture content is authoritative during designing and construction of machinery and process equipment related to sesame. It may be also beneficial in computation of design for hoppers, silos, conveyors, drying, and heat transfer equipment as well as other sesame seed‐related process and handling equipment.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.