Quality versus cost analysis for 3D Stacked ICs

Abstract

To fulfill customer demands, IC products must satisfy the required quality generally expressed in defective parts per million (DPPM). To meet this DPPM target, appropriate test infrastructures and test approaches must be developed. This is a challenging task for 3D Stacked-ICs (3D-SIC) due to a large test flow space; each test flow may require different design-for-test features and impact the product quality and total stack cost differently. Therefore, appropriate models to predict the impact of test flows on the product quality and overall stack cost at early design stage is important for quality versus cost trade-offs. This paper presents a model that predicts the 3D product quality in terms of DPPM for different test flows and associated cost; it incorporates the quality of the wafer manufacturing, stacking and packaging process. For example, the presented case study showed that maintaining the same product quality for larger stack size might result in a significant test cost increase.