Abstract
This study deals with the characteristics of blind via holes drilled using a laser beam on the multi-layer printed wiring boards. In the present report, we proposed a heat input model in laser drilling using the finite element method (FEM) in order to estimate the temperature in the bottom copper foil of blind via holes for the circuit connection between layers. On the other hand, the temperatures of copper foil in laser drilling were measured by thermo-couple. As a result, the calculated temperatures by this model considering the variation of the absorption of foil surface in laser drilling are good agreement with the experimental ones. It is confirmed that this model is effective to estimate the temperatures and thermal stresses in the bottom copper foil in laser drilling.
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