Abstract
This paper discusses the requirements of quality assurance of electronics assemblies with respect to the surface conditions, and more particularly the problems introduced by modern assembly techniques. Ionic contamination testing and surface insulation resistance measurement are dealt with as complementary techniques. Particular emphasis is laid on the fact that standards related to both QC methods are inadequate and do not reflect modern needs. Cleaning, as a corollary to contamination, is touched upon without detail, other than a table comparing methods as a function of purchasing and operating costs, technical performance, etc.
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