Abstract
In this work, the development of a planar interdigital capacitive sensor, directly onto the surface of a composite, for determining the initial quality of curing of bonded composite joints and assessing their long-term durability is presented. The sensor consisted of an interlocking comb-shaped array of silver electrodes and used to monitor the progress of cure of an adhesive resin and the subsequent damage state of the bond line in adhesively-bonded composite joints using impedance spectroscopy. The obtained results from the mechanical characterization indicated that the developed sensor did not affect the quality of the bondline while the added weight of the sensor is negligible. The curing process of the adhesive epoxy was successfully monitored while the ability of the sensor to assess the developed damage created by the mechanical loading was confirmed using transient infrared thermography.
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