Abstract
Heat stress adversely affects wheat production in many regions of the world and is particularly detrimental during reproductive development and grain-filling. The objective of this study was to identify quantitative trait loci (QTL) associated with heat susceptibility index (HSI) of yield components in response to a short-term heat shock during early grain-filling in wheat. The HSI was used as an indicator of yield stability and a proxy for heat tolerance. A recombinant inbred line (RIL) population derived from the heat tolerant cultivar ‘Halberd’ and heat sensitive cultivar ‘Cutter’ was evaluated for heat tolerance over 2 years in a controlled environment. The RILs and parental lines were grown in the greenhouse and at 10 days after pollination (DAP) half the plants for each RIL received a three-day heat stress treatment at 38°C/18°C day/night, while half were kept at control conditions of 20°C/18°C day/night. At maturity, the main spike was harvested and used to determine yield components. A significant treatment effect was observed for most yield components and a HSI was calculated for individual components and used for QTL mapping. QTL analysis identified 15 and 12 QTL associated with HSI in 2005 and 2006, respectively. Five QTL regions were detected in both years, including QTL on chromosomes 1A, 2A, 2B, and 3B. These same regions were commonly associated with QTL for flag leaf length, width, and visual wax content, but not with days to flowering. Pleiotropic trade-offs between the maintenance of kernel number versus increasing single kernel weight under heat stress were present at some QTL regions. The results of this study validate the use of the main spike for detection of QTL for heat tolerance and identify genomic regions associated with improved heat tolerance that can be targeted for future studies.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.