热像仪对QFN封装表面发射率环境透射率的标定

Abstract

Using infrared thermal imager calibrated the epoxy molding compound(EMC), copper, copper joints surface emissivity of not separated QFN package within 40-200℃, using the above three surface calibrated the air transmittance. The results show that the direct calculation method and direct adjustment method can be well applied in the calibration of EMC, direct calculation method can be well applied in the calibration of copper joints and copper solder. The emissivity calibration results of EMC is in 0.97 or so; the emissivity calibration results of copper joints with a linear change from 0.17 to 0.35 when the temperature increased; the emissivity calibration value of copper surface increased after the first stabled. The air transmittance calibration value of EMC surface and copper joints were around 100%, fluctuated less than 2%. The experimental results could provide some corresponding parameters for infrared termograph during the process measuring QFN using temperature and cutting separation temperature.