PZT-based piezoelectric composites via a modified sol–gel route

Abstract

A novel hybrid sol–gel approach is developed to prepare composite PZT films in the thickness range 1–20 μm at relatively low sintering temperatures (<600°C). In this approach, a dip-coating method (thickness<5 μm) is used to deposit films from a sol–gel solution with dispersed PZT powder. Thicker films (>5 μm) are fabricated using sedimentation of the PZT powder onto Pt-coated Si substrates with a subsequent multiple infiltration of powder coatings with PZT sol–gel solution. Dielectric and ferroelectric properties of thick films are studied and discussed in the framework of existing models of composites.