Abstract

The objective of this study was to evaluate the use of pyruvic acid as an alternative etching agent to phosphoric acid (H3PO4). Solutions containing 5, 10, 15, 20, 25, and 30 m/m % pyruvic acid and 50% m/m H3PO4 were prepared. The tensile bond strengths of a composite resin to enamel surfaces etched with the respective etching agents were determined. The rates of etching of enamel surfaces by each of the etching solutions were evaluated. Unground and polished enamel surfaces were etched with the respective etching solutions and the surfaces examined by scanning electron microscopy. The tensile bond strengths of the resin to enamel surfaces etched with 10-30% pyruvic acid exceeded those obtained on enamel surfaces etched with 50% H3PO4. The rates of etching of all the pyruvic acid solutions were significantly less than of H3PO4. Well-defined etching patterns were observed on the enamel surfaces etched with all the etching solutions. The results of this laboratory study suggest that pyruvic acid may be a suitable alternative to phosphoric acid as an etching agent in clinical dentistry.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.