Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers

Abstract

In electrical and mechanical industries, forming a pure copper layer on various substrates would improve the performance of automotive motors, batteries, etc. However, the formation of a pure copper layer has yet to be reported on a pure copper substrate. Here, a pure copper layer is formed on a pure copper substrate (C10200) using a multi-beam laser cladding system with blue diode lasers. The powder mass efficiency increases with the laser intensity. These results are used to construct a powder temperature model. At a laser intensity of $$6.5 \times 10^{4} {\text{ W}}/{\text{cm}}^{2}$$ , 9.65% of the powder forms a copper layer. In the supplied powder, approximately 5% of the powder is melted on the fly. In addition, about 5% of the powder is melted after trapping on the substrate. Hence, melting powder on the fly and melting the trapped powder on the substrate form the copper layer.