Pulsed magnetic field processing of silicon substrates prior to thermal spray film deposition

Abstract

Prior to depositing thin metal sulfide films by spraying aqueous solutions of thiocarbamide complexes of the corresponding metals onto heated silicon substrates, the semiconductor substrates were subjected to a pulsed magnetic field treatment. This additional processing considerably decreases hydrophobicity of the silicon wafer surface, thus favoring the subsequent formation of high-quality homogeneous sulfide films with good adhesion to the substrate.