Pulsed chemical vapor deposition for crystalline aluminum nitride thin films and buffer layers on silicon and silicon carbide

Abstract

Low temperature aluminum nitride (AlN) deposition has applications ranging from serving as a heat spreading material to serving as a buffer layer for III-V semiconductors on silicon or silicon carbide (SiC) for radio frequency, power, and microLED devices. While crystalline AlN is traditionally deposited at high temperature (>800 °C), in the present study AlN is deposited on Si(100), Si(111), and 4H-SiC substrates by two modest temperature processes using a metal precursor with high thermal stability, tris(dimethylamido) aluminum (III), and a highly reactive nitrogen source, anhydrous hydrazine. A 580 °C pulsed chemical vapor deposition (CVD) process is compared to a more complex 400 °C atomic layer annealing process, in which the same precursors are utilized with periodic ion bombardment to induce film crystallinity. Films deposited by both processes template preferential c-axis orientation in subsequently sputtered AlN on unheated substrates. Both templating techniques demonstrate equivalent enhancements in crystallinity of the sputtered AlN relative to a non-templated sputtered film by x-ray diffraction and transmission electron microscopy studies. On 4H-SiC substrates, a comparison of sputtering directly and templating with the 580 °C pulsed CVD process reveals epitaxial deposition by the 580 °C pulsed CVD process which extends into the low temperature sputtered AlN.